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http://cimav.repositorioinstitucional.mx/jspui/handle/1004/1550| RARE EARTH ADDITION EFFECT ON MICROSTRUCTURE AND NTERMETALLIC LAYER GROWTH KINETICS ON LEAD-FREE SOLDER SN-AG-Bi | |
| MIGUEL ANGEL NERI FLORES CALEB CARREÑO GALLARDO ALBERTO MARTINEZ VILLAFAÑE | |
| Acceso Abierto | |
| Sin Derechos Reservados | |
| Nd | |
| n an Sn-Ag-Bi alloy were added rare earth (Nd, Pr) in order to determine their effect on the growth kinetics of the intermetallic layer of tin-copper. There were prepared 3 different alloys: Sn-Ag-Bi as a reference, Sn-Ag-Bi + Nd, and Sn-Ag-Bi + Pr These alloys were applied to a copper substrate, and were given the aging heat treatment at temperatures of 50, 100, 120, and 150 ° C at different residence times (0,50,150, and 250 hours) in order to determine the kinetics of intermetallic layer growth of tin-copper, and to determine the evolution of the microstructure of the solder. | |
| 2011 | |
| Memoria de congreso | |
| Inglés | |
| OTRAS | |
| Versión revisada | |
| submittedVersion - Versión revisada | |
| Aparece en las colecciones: | Artículos de Congresos |
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| sim07-abs066.pdf | 9.67 kB | Adobe PDF | Visualizar/Abrir |