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http://cimav.repositorioinstitucional.mx/jspui/handle/1004/511| Stress analysis in a classical double lap, adhesively bonded joint with a layerwise model | |
| ALBERTO DIAZ DIAZ | |
| Acceso Abierto | |
| Atribución-NoComercial-SinDerivadas | |
| https://doi.org/10.1016/j.ijadhadh.2008.01.004 | |
| Stress analysisPealLayerwise model | |
| This paper focuses on stress analysis in classical double lap, adhesively bonded joints having constant layer thicknesses. Several analytical methods found in the literature do not provide adequate information on stresses at the adherend/adhesive interfaces. In these methods, the adhesive thickness is assumed to be small compared to that of the adherends and the stresses to be uniform through the adhesive thickness. Herein, the model proposed by the authors can be considered as a stacking of Reissner–Mindlin plates (six plates for a double lap joint). The equations based on stacked plates were applied to the geometry of a symmetrical, double-lap, adhesively bonded joint. Finally, the model has been validated by comparing the model results with those of a finite element calculation. | |
| 2003 | |
| Artículo | |
| Inglés | |
| Diaz, A. D., Hadj-Ahmed, R., Foret, G., & Ehrlacher, A. (2009). Stress analysis in a classical double lap, adhesively bonded joint with a layerwise model. International Journal of Adhesion and Adhesives, 29(1), 67-76. | |
| QUÍMICA | |
| Aparece en las colecciones: | Artículos |
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|---|---|---|---|---|
| Stress analysis in a classical double lap, adhesively bonded joint with a layerwise model.pdf | 885.08 kB | Adobe PDF | Visualizar/Abrir |